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Journal Article

Review: Reliability, Yield and Stress Burn-In: A Unified Approach for Microelectronics Systems Manufacturing and Software Development by W. Kuo; W. T. K. Chien; T. Kim

Reviewed Work: Reliability, Yield and Stress Burn-In: A Unified Approach for Microelectronics Systems Manufacturing and Software Development by W. Kuo, W. T. K. Chien, T. Kim
Review by: Francisco J. Samaniego
Technometrics
Vol. 41, No. 4 (Nov., 1999), pp. 371-372
DOI: 10.2307/1271359
Stable URL: http://www.jstor.org/stable/1271359
Page Count: 2
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